22nd Microelectronics and Packaging Conference (EMPC-2019) & Exhibition
The best of microelectronics packaging and interconnection technologies in Europe
Palazzo dei Congressi Pisa, Italy – 16-19 September, 2019
Laboratorio NEST participates to EMPC-2019 within the R&D VillageR&D VillageR&D Village initiative.
We have reduced fees for students.
The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading event. Next year it will take place in Pisa, Italy
Short Courses on September 16th
The informative short courses preceding the conference provide the opportunity to learn and progress your professional development.
>SC1: MEMS SENSORS AND ACTUATORS, Instructor: Prof. Gabor Harsanyi, Budapest University of Technology and Economics, Department of Electronics Technology, Budapest, Hungary
>SC2: THE SCIENCE OF BOND TESTING, Instructor: Bob Sykes, XYZTECbv, The Netherlands
>SC3: 3D (CT) X-RAY FOR ELECTRONICS, Instructor: Dr. David Bernard, X-ray Consultant for the Electronics Industry, Watford, U.K.
>SC4: HERMETIC PACKAGING, Instructor: Marco Moraja, Business Manager at SAES Getters, Milano, Italy
>SC5: ADVANCED IC PACKAGING AND CHIP/PACKAGE/BOARD CO DESIGN ENVIRONMENT, Instructor: Mr. Iyad Rayane, Application Engineer at Zuken
Do not miss the opportunity to attend one of these short courses!
Click HEREHEREHERE and register now!